The Fundamentals of Failure Analysis in Electronics

Goals

The objectives of the training The Fundamentals of Failure Analysis in Electronics :

At the end of this training course, participants will be able to understand the role and challenges of failure analysis in the product life cycle.
• 24 & 25.11.2026 - Toulouse

The aim of this training course is to:

• Identify and apply the key steps in a structured failure analysis approach.


• Use problem-solving tools (8D, Ishikawa, 5 Why, etc.).


• Distinguish and select the non-destructive and destructive analysis techniques appropriate for each case.

Program

1. Introduction to failure analysis
• Definition and challenges for quality, reliability and customer support
• Types of electronic failures: random, permanent, intermittent, latent
• Objectives of failure analysis: understanding, correction, prevention
• Examples of typical situations in production, in the field, in qualification


2. General approach to failure analysis
• Information gathering (context, history, conditions of occurrence)
• Formulation of hypotheses (failure mode and mechanism)
• Investigation plan (choice of analysis tools)
• Confirmation of the hypothesis
• Feedback and corrective actions
• Importance of traceability and documentation


3. Problem-solving tools
• Structured reasoning methods:
- 5 Whys
- Ishikawa / cause-and-effect diagram
- 8D (Eight Disciplines): structure of a standard report
- Analysis of failure modes, their effects and their criticality (FMEA)
• Simplified case studies


4. Non-destructive analysis techniques
• Objectives: identify without altering the product
• Typical tools
- Visual inspection (stereomicroscope)
- X-rays / 2D X-rays & CT scans
- Optical microscopy and scanning electron microscopy (SEM / EDX)
- Active/passive infrared thermography
- Functional electrical curves
- Acoustics (C-SAM/SAT) to detect delamination or cracks


5. Destructive techniques
• Objectives: confirm causes by opening or controlled destruction
• Common tools
- Chemical or mechanical decapsulation
- Cross-section (micro-section) and metallographic preparation
- Polishing and ion etching
- Scanning electron microscopy (SEM/EDX)
- Materials analysis (FTIR, TGA, DSC, TMA, DMA)


6. Case studies and practical exercises
• Objectives: discover our analysis methods through concrete application cases
- Examples: BGA ball cracking, electrochemical migration, corrosion, delamination, cold soldering, etc.
- Presentation of a failure report
- Discoveries and practical workshops on analytical equipment (SEM, FTIR, X-ray and others)
- Image analysis (X-ray, microscopy, cross-section)