The Fundamentals of Failure Analysis in Electronics

Goals

The objectives of the training The Fundamentals of Failure Analysis in Electronics :

At the end of this training course, participants will be able to understand the role and challenges of failure analysis in the product life cycle.

The aim of this training course is to:

• Identify and apply the key steps in a structured failure analysis approach.


• Use problem-solving tools (8D, Ishikawa, 5 Why, etc.).


• Distinguish and select the non-destructive and destructive analysis techniques appropriate for each case.

Program

1. Introduction to failure analysis
• Definition and challenges for quality, reliability and customer support
• Types of electronic failures: random, permanent, intermittent, latent
• Objectives of failure analysis: understanding, correction, prevention
• Examples of typical situations in production, in the field, in qualification


2. General approach to failure analysis
• Information gathering (context, history, conditions of occurrence)
• Formulation of hypotheses (failure mode and mechanism)
• Investigation plan (choice of analysis tools)
• Confirmation of the hypothesis
• Feedback and corrective actions
• Importance of traceability and documentation


3. Problem-solving tools
• Structured reasoning methods:
- 5 Whys
- Ishikawa / cause-and-effect diagram
- 8D (Eight Disciplines): structure of a standard report
- Analysis of failure modes, their effects and their criticality (FMEA)
• Simplified case studies


4. Non-destructive analysis techniques
• Objectives: identify without altering the product
• Typical tools
- Visual inspection (stereomicroscope)
- X-rays / 2D X-rays & CT scans
- Optical microscopy and scanning electron microscopy (SEM / EDX)
- Active/passive infrared thermography
- Functional electrical curves
- Acoustics (C-SAM/SAT) to detect delamination or cracks


5. Destructive techniques
• Objectives: confirm causes by opening or controlled destruction
• Common tools
- Chemical or mechanical decapsulation
- Cross-section (micro-section) and metallographic preparation
- Polishing and ion etching
- Scanning electron microscopy (SEM/EDX)
- Materials analysis (FTIR, TGA, DSC, TMA, DMA)


6. Case studies and practical exercises
• Objectives: discover our analysis methods through concrete application cases
- Examples: BGA ball cracking, electrochemical migration, corrosion, delamination, cold soldering, etc.
- Presentation of a failure report
- Discoveries and practical workshops on analytical equipment (SEM, FTIR, X-ray and others)
- Image analysis (X-ray, microscopy, cross-section)