The Fundamentals of Failure Analysis in Electronics

Goals

The objectives of the training The Fundamentals of Failure Analysis in Electronics :

Upon completion of this training, participants will be able to understand the role and challenges of failure analysis in the product life cycle.

The goal of this training is to:
• Identify and apply the key steps of a structured failure analysis process.
• Use problem-solving tools (8D, Ishikawa, 5 Whys, etc.).
• Distinguish between and select the non-destructive and destructive analysis techniques appropriate for each case.

Session dates:
• from 23/11/2027 to 24/11/2027 - Toulouse
Contact: +33 04 76 49 76 76 | formation@sopemea.fr

Financial details:
• Financial assistance options based on your status (Company, Employee, Job Seeker) through your OPCO, France Travail, or any other funding agency
• Not eligible for the Professional Training Account (CPF)

Program

1. Introduction to failure analysis
• Definition and challenges for quality, reliability and customer support
• Types of electronic failures: random, permanent, intermittent, latent
• Objectives of failure analysis: understanding, correction, prevention
• Examples of typical situations in production, in the field, in qualification


2. General approach to failure analysis
• Information gathering (context, history, conditions of occurrence)
• Formulation of hypotheses (failure mode and mechanism)
• Investigation plan (choice of analysis tools)
• Confirmation of the hypothesis
• Feedback and corrective actions
• Importance of traceability and documentation


3. Problem-solving tools
• Structured reasoning methods:
- 5 Whys
- Ishikawa / cause-and-effect diagram
- 8D (Eight Disciplines): structure of a standard report
- Analysis of failure modes, their effects and their criticality (FMEA)
• Simplified case studies


4. Non-destructive analysis techniques
• Objectives: identify without altering the product
• Typical tools
- Visual inspection (stereomicroscope)
- X-rays / 2D X-rays & CT scans
- Optical microscopy and scanning electron microscopy (SEM / EDX)
- Active/passive infrared thermography
- Functional electrical curves
- Acoustics (C-SAM/SAT) to detect delamination or cracks


5. Destructive techniques
• Objectives: confirm causes by opening or controlled destruction
• Common tools
- Chemical or mechanical decapsulation
- Cross-section (micro-section) and metallographic preparation
- Polishing and ion etching
- Scanning electron microscopy (SEM/EDX)
- Materials analysis (FTIR, TGA, DSC, TMA, DMA)


6. Case studies and practical exercises
• Objectives: discover our analysis methods through concrete application cases
- Examples: BGA ball cracking, electrochemical migration, corrosion, delamination, cold soldering, etc.
- Presentation of a failure report
- Discoveries and practical workshops on analytical equipment (SEM, FTIR, X-ray and others)
- Image analysis (X-ray, microscopy, cross-section)